主要学术成果（论文、专利、专著、译著等） |
发表SCI论文60余篇。 近期代表性成果： [1] G.T. Zhai, Y.S. Wang, L.M. Ma, F. Guo, Y. Tian, W. Zhou, Q. Hu, F.W. Zhang, Effect of grain boundary on failure behavior of SABI333 solder joints during creep, J. Mater. Sci.-Mater. Electron., 31 (2020) 5017-5024. [2] Y. Wang, Y.S. Wang, L.M. Ma, J. Han, F. Guo, Effect of Sn Grain c-Axis on Cu Atomic Motion in Cu Reinforced Composite Solder Joints Under Electromigration, Journal of Electronic Materials, 49 (2020) 2159-2163. [3] Y. Tian, L.M. Ma, Y.S. Wang, F. Guo, Z.J. Sun, The Growth of Interfacial IMC Layer in SAC0307 Solder Joints with Specific Grain Orientation Under Electrical and Thermal Coupling Fields, Journal of Electronic Materials, 49 (2020) 202-211. [4] X.W. Zhao, L. Ma, Y.S. Wang, F. Guo, Effects of twin boundaries on the void formation in Cu-filled through silicon vias under thermal process, J. Mater. Sci.-Mater. Electron., 30 (2019) 5845-5853. [5] X.W. Zhao, L.M. Ma, Y.S. Wang, F. Guo, Effect of Thermal Mechanical Behaviors of Cu on Stress Distribution in Cu-Filled Through-Silicon Vias Under Heat Treatment, Journal of Electronic Materials, 47 (2018) 142-147. |
